When size, performance and system integration are critical to your application, our technologies and miniaturization techniques can help make your products smaller, smarter and more reliable. We specialize in microelectronic assembly, miniaturization and integrated power electronics modules services. We supplement these services with our in-house design, substrate and testing capabilities.
Our offerings include custom ASICs, FPGAs, RF modules and ICs, multi-chip packages and ruggedized design services. We work closely with you to provide solutions that meet your specifications for products that need to survive in the harshest environments, defend against security threats, use the lowest possible power, take up the smallest space or meet other performance requirements.
We offer full supply chain management and scalable manufacturing processes will support your project, from design and development all the way through production.
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