Elig Brake Technologies Corp.


Correspondence: English
Yearly Turnover: USD 10, 700, 000
Export: 100
Foundation: 1998
Operation Level: International

Address: (No 449, Jhong Shan Rd., Jinshan Dist.)
208 New Taipei City Taiwan
Phone: +886 2 2498 9838
Fax: +886 2 2498 9836
Web: http://www.elig-tw.com


Experts In Friction Material Research and Product Development:
1. Having three R&D centers in Taiwan, Japan and USA focusing on developing advanced "Elig Friction Technology" (E.F.T.).
2. Employing full test instruments including Dynamometer, based on 1:1 real world vehicle operating simulations to develop products meeting customer requirements.
3. Specializing in producing brake pads and clutches, made of ceramic, semi-metallic, sinter and NAO, for trucks, buses, automobiles, motorcycles, industrial and agricultural machineries.

Three Guarantees:
1. All products are 100% asbestos-free ingredient and conformed by EU ROHS.
2. All products conform to the safety requirements in EU, USA or Japan and are covered by USD1,000,000 global product liability insurance.
3. All products are being produced according to ISO 9001 and TS16949.

Brake Pad. Brake Shoe
Brake Clutch, Brake Disc
Caliper, Master Cyliner

TAIPEI AMPA
International auto and motorcycle parts and accessories show
17/04/2024 - 20/04/2024
Location Taipei World Trade Center Nangang Exhibition Hall
Taipei
Taiwan
AUTOPAR
International exhibition for suppliers of automotive industry
08/05/2024 - 11/05/2024
Location EXPOTRADE
Curitiba
Brazil
AUTOMECHANIKA FRANKFURT in conjunction with REIFEN
International trade fair for the automotive aftermarket industries
10/09/2024 - 14/09/2024
Location Messe Frankfurt
Frankfurt/Main
Germany
AAPEX
International automotive aftermarket products exhibition
05/11/2024 - 07/11/2024
Location Sands Expo
Las Vegas
United States of America
AUTOMECHANIKA SHANGHAI
International trade fair for the automotive aftermarket industries
02/12/2024 - 05/12/2024
Location National Exhibition and Convention Center (Shanghai) (NECC)
Shanghai
China, P.R.